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TOPIC: DESIGNED BY OREGON STATE UNIVERSITY IN CHINA.

DESIGNED BY OREGON STATE UNIVERSITY IN CHINA. 4 months, 3 weeks ago #6367

  • freemexy
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DESIGNED BY OREGON STATE UNIVERSITY IN CHINA.



This board is RF application ,the minimum trace is 3mil and the space is 3 mil too. But the most unusal is there are two cavities on board,the cavities are plated,it is not through from top to bottom .the depth is 10mil from top and plated .To get more news about Cavity PCB, you can visit pcbmake official website.
The cavity is for bonding chips,the best surface finishing is ENEPIG for bonding.
Storm Circuit made lots of such RF application boards with high frequency material.
Summit’s highly advanced product line of PCBs are manufactured to offer optimum solutions for challenging conditions. Expertise in these technologies makes it possible for a secure connection of device components with the assurance of contact stability. Advantages of our manufacturing capabilities provide our PCBs with dynamic and mechanical stability, quick integration, precise and powerful performance and superior reliability which makes them ideal for complex requirements.
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